In PCB manufacturing, the curing quality of solder mask directly affects board insulation performance and subsequent process yields. Ergutech's LY series UV curing equipment (365nm wavelength, 800–1200mJ/cm² energy output) has helped multiple PCB manufacturers achieve efficient and uniform solder mask curing. Three actual cases are presented below.
Case 1: A Multilayer Board Factory in Suzhou – Rework Due to Non-Uniform Curing
This factory produces 4–8 layer PCBs for consumer electronics. After screen printing, the original UV equipment, due to aged light sources and uneven energy distribution, caused significant curing differences between the center and edges of the boards. During developing, residual solder mask or excessive loss occurred, leading to a monthly rework rate of approximately 8%.
After introducing the Ergutech LY series, the 365nm wavelength combined with a uniform light field design delivered a stable energy output of 1000mJ/cm². The cured solder mask showed even crosslinking, and the developing yield increased to over 98.5%, significantly reducing rework labor hours.
Case 2: An HDI Board Factory in Dongguan – Insufficient Curing on Hole Walls of Thick Copper Boards
This factory produces HDI boards with thick copper layers. Solder mask covers hole walls and areas with height differences. The original equipment lacked sufficient light intensity, leading to incomplete crosslinking deep in the hole walls, which caused blistering after soldering.
By adopting the LY series with adjustable energy output (800–1200mJ/cm²), the exposure dose was appropriately increased for thick copper boards. Cross-section analysis after curing showed fully crosslinked solder mask on hole walls, which passed thermal shock testing, and blistering defects were eliminated.
Case 3: A Quick-Turn PCB Factory in Huizhou – Production Line Pace and Space Constraints
Quick-turn PCB business requires rapid material flow after screen printing. The original hot-air circulation curing method occupied a separate oven room with a batch time of 40 minutes and equipment footprint of about 20 square meters.
The factory integrated the LY series directly into the conveyor line after screen printing. Curing time was reduced to tens of seconds, and equipment footprint was less than 3 square meters. The adhesion and hardness of the cured solder mask met customer standards, and the line turnover efficiency improved significantly.
The LY series, with 365nm wavelength and 800–1200mJ/cm² energy output, provides a uniform and controllable UV curing solution for PCB solder mask. The equipment has a compact design and is compatible with various board types and ink systems. It has been operating stably in multilayer, HDI, and quick-turn PCB production lines. For process testing or equipment selection support, please contact Ergutech.
